Intel is nearing completion of its RM30 billion advanced semiconductor packaging facility in Malaysia. The plant is expected to begin operations within this year.
MIDA Chairman Tengku Zafrul Tengku Abdul Aziz confirmed the project marks a new stage for the local semiconductor industry. Intel has maintained a 54-year presence in Malaysia with a cumulative investment of RM49.3 billion.
The facility expands Intel’s global assembly and testing capabilities through advanced packaging technology. This project will create high-value jobs and strengthen Malaysia’s position in the global chip supply chain. Intel identifies advanced packaging as a strategic driver for future product and margin growth.