NVIDIA is accelerating the development of its next-generation Feynman AI platform. Key supplier TSMC is significantly increasing its advanced packaging capacity to meet this demand.
TSMC targets a monthly output of 50,000 System-on-Integrated-Chips (SoIC) wafers by the end of 2027. The manufacturer is expediting construction of its AP7 and AP8 fabrication plants to reach this goal.
NVIDIA expects to begin mass production of the Feynman architecture in late 2028. The new platform utilizes advanced 3D chip stacking and SoIC technology.