Taiwan Semiconductor Manufacturing (TSM) confirmed that its advanced 2-nanometer (N2) chips have entered High-Volume Manufacturing (HVM), solidifying its technical lead and marking the start of the Angstrom Era.
- The transition to the GAAFET architecture achieved strong initial yield rates of 70-80%, suggesting a rapid volume ramp-up crucial for meeting high AI chip demand.
- The new N2 node provides a 15% speed boost and 30% power reduction compared to previous generations.
- TSM shares are trading 2.13% higher in response to the landmark achievement.