Supply chain sources report Meta's next-generation AI accelerator, the MTIA-3, is scheduled for debut in the second half of 2026. TSMC will manufacture the MTIA-3 using its 3nm process.
This follows the MTIA-2 chip, which is expected in the first half of the year. The MTIA-2 is also built on the 3nm advanced node.
TSMC affiliate Global Unichip Corp. (GUC) will handle backend packaging and wafer processing for the MTIA-3.
The collaboration highlights sustained, strong demand for TSMC's advanced manufacturing technologies. TSMC maintains an integral role in the rapidly expanding artificial intelligence infrastructure.