Taiwan Semiconductor Manufacturing Company (TSMC) detailed its roadmap for the 'Angstrom Era,' centered on the A14 (1.4nm) process node. Volume production for the A14 is slated for 2028.
The company confirmed its N2 (2nm) node has achieved full-scale mass production in Taiwan. This transition marks the industry's first volume deployment of nanosheet transistor architecture.
TSMC is accelerating its US expansion to bolster its global manufacturing footprint. Fab 21 in Phoenix, Arizona, currently runs full volume production of 4nm and 5nm chips.
The company will bring 3nm (N3) production to the US by 2027. This timeline moves the launch a year ahead of its original schedule.