Huawei announced an accelerated roadmap for its next-generation artificial intelligence chips at its annual conference in Shanghai. The company will launch the Ascend 960DT AI chip in the first quarter of 2027. This release occurs several months ahead of the original schedule.
Huawei plans to release the Ascend 970 series in 2028. The Ascend 980 series will follow in 2029. These developments aim to secure technological independence in response to U.S. trade restrictions.
The company also debuted the Atlas 960 SuperPoD computing cluster for AI model training. This system utilizes UnifiedBus networking technology to link thousands of processors. This strategy compensates for individual chip performance gaps through large-scale hardware integration.
Huawei’s progress threatens NVIDIA’s market dominance as Chinese firms transition to homegrown hardware. The announcement precedes a potential U.S.-China summit, adding geopolitical weight to the technological rivalry.