Intel CEO Pat Gelsinger warned on September 16, 2026, that the high-bandwidth memory (HBM) shortage is intensifying. Limited production capacity for these essential AI components is causing significant project delays. HBM prices have surged to seven times their previous levels.
This supply constraint threatens to bottleneck global AI infrastructure expansion. The surge in demand stems from the AI boom, leaving manufacturers like Samsung, SK Hynix, and Micron struggling to keep pace. This demand is also tightening the supply of general memory products.
Gelsinger identified power supply and cooling technology challenges as additional hurdles for advanced chip production. These factors create significant headwinds for the semiconductor industry's support of explosive AI growth.