Samsung Electronics and Broadcom signed a strategic partnership on Saturday at an AI Summit in San Francisco. The collaboration spans memory, contract chipmaking, and advanced packaging. Total deal value is projected to exceed $200 billion by 2030.
The memorandum of understanding establishes a stable supply chain for critical AI components. Broadcom will provide long-term production commitments to Samsung’s foundry business. This agreement strengthens Samsung’s competitive position against market leader TSMC.
The partnership integrates Broadcom’s expertise in application-specific integrated circuits (ASICs) with Samsung’s manufacturing capabilities. Samsung will deploy its sub-2-nanometer process technology for production. The deal also covers next-generation High-Bandwidth Memory (HBM) products.