Taiwan Semiconductor Manufacturing Co. (TSMC) will construct three advanced packaging plants in Taiwan’s Chiayi Science Park. The National Science and Technology Council Minister confirmed the expansion targets surging AI chip demand. These processors utilize TSMC’s proprietary Chip-on-Wafer-on-Substrate (CoWoS) packaging technology.
TSMC commenced construction on the first facility in June. The company expects two additional plants in the park's first phase to enter production. These facilities will begin mass output in 2027. The project aligns with increased capital expenditure for next-generation process nodes and advanced packaging capacity.